Protection of unsealed electrical connectors

ABSTRACT

A monitoring system for connector pins exposed to conductive/corrosive fluids and/or corrosive environments includes a first sensing portion having a pin monitoring section configured to measure a pin current flow of at least one conductor pin, and transfer a first signal. A second sensing portion produces a second signal indicating by a contactless determination the presence of a fastener providing physical connection between an interface member and a component. A decision logic device receives the first and second signals, compares the pin current flow to a predetermined range of values, and isolates electrical power to the conductor pin when the first signal indicates the pin current flow is outside the predetermined range of values. A sensor body created of a non-ferrous material and connected to the component includes a first insert member having the conductor pin and a second insert member defining a sensor sensing proximal presence of the fastener.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. Ser. No. 12/789,543 filed May28, 2010. The disclosure of the above application is incorporated hereinby reference.

FIELD

The present disclosure relates to electrical devices having connectorsdegraded when exposed to conductive/corrosive fluids and includingcorrosive environments.

BACKGROUND

This section provides background information related to the presentdisclosure which is not necessarily prior art.

Electrical contacts in equipment such as communication devices subjectedto exposure to conductive fluids such as seawater, chemicals, andincluding corrosive environments such as salt spray and fog and thelike, herein collectively referred to as conductive/corrosive fluids,can suffer electrical contact degradation by electrolysis includinggalvanic corrosion between terminals, contacts, connecting pins and thelike that are energized or connected to a current source (activelysignaling or power supply). Exposure to conductive/corrosive fluids canrapidly oxidize the connectors. Active methods to obviate corrosioninclude manual disablement of the electrical interface. This method isnot effective if the operator fails to disable the interface. Passivemethods are known which further seal the terminal or pin areas whichcommonly include addition of covers, fasteners, seal members such asO-rings, and/or sealants. Access requirements to incorporate thefasteners, seal members or sealants however, can themselves introduceadditional paths for the conductive/corrosive fluid entrance, and thusmay exacerbate the corrosion problem.

SUMMARY

This section provides a general summary of the disclosure, and is not acomprehensive disclosure of its full scope or all of its features.

According to several embodiments of the present disclosure, a monitoringsystem for conductor pins exposed to conductive/corrosive fluids andcorrosive environments includes a first sensing portion having a pinmonitoring section adapted to measure a pin current flow of at least oneconductor pin, compare the pin current flow to a predetermined range ofvalues, and produce a first signal. A decision logic device receives thefirst signal and isolates electrical power to the at least one pin whenthe first signal indicates the pin current flow of the at least oneconductor pin is outside of the predetermined range of values.

According to other embodiments, a monitoring system for conductor pinsexposed to conductive/corrosive fluids includes a first sensing portionhaving a pin monitoring section operating to measure a pin current flowof at least one conductor pin, compare the pin current flow to apredetermined range of values, and produce a first signal. A secondsensing portion produces a second signal indicating by a contactlessdetermination the presence of a fastener providing physical connectionbetween an interface member and a component having the at least oneconductor pin positioned therein. A decision logic device receiving thefirst and second signals isolates electrical power to the at least onepin when the first signal indicates the pin current flow of at least oneconductor pin is outside of the predetermined range of values.

According to still further embodiments, a monitoring system formonitoring a current draw through a plurality of conductor pins includesa component such as a cabinet. A sensor body created of a non-ferrousmaterial connected to the component includes a first insert memberhaving a first plurality of conductor pins extending therefrom. A secondinsert member defines a sensor to sense proximal presence of a fastener.A blind fastener engagement aperture is created in the sensor bodyproximal to the second insert member and is spaced from the sensor by abody wall of the non-ferrous material. An interface member has a secondplurality of conductor pins extending therefrom. The interface member isreleasably connected to the component having individual ones of thefirst plurality of conductor pins connected to individual ones of thesecond plurality of conductor pins. A fastener coupled to the interfacemember has an engagement end extending beyond the interface member andengaged within the fastener engagement aperture of the sensor body toreleasably connect the interface member to the component. The sensorsenses a presence of the engagement end and creates a fastener presentsignal indicating presence of the engagement end.

Further areas of applicability will become apparent from the descriptionprovided herein. The description and specific examples in this summaryare intended for purposes of illustration only and are not intended tolimit the scope of the present disclosure.

DRAWINGS

The drawings described herein are for illustrative purposes only ofselected embodiments and not all possible implementations, and are notintended to limit the scope of the present disclosure.

FIG. 1 is front perspective view of unassembled components of anelectronic device assembly;

FIG. 2 is a front perspective view of the electronic device assembly ofFIG. 1 following component assembly; and

FIG. 3 is a diagrammatic view of a monitoring system including theassembled electronic device of FIG. 2.

Corresponding reference numerals indicate corresponding parts throughoutthe several views of the drawings.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference tothe accompanying drawings and are provided so that this disclosure willbe thorough, and will fully convey the scope to those who are skilled inthe art. Numerous specific details are set forth such as examples ofspecific components, devices, and methods, to provide a thoroughunderstanding of embodiments of the present disclosure. It will beapparent to those skilled in the art that specific details need not beemployed, that example embodiments may be embodied in many differentforms and that neither should be construed to limit the scope of thedisclosure. In some example embodiments, well-known processes,well-known device structures, and well-known technologies are notdescribed in detail.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting. As usedherein, the singular forms “a”, “an” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. The terms “comprises,” “comprising,” “including,” and“having,” are inclusive and therefore specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The method steps, processes, and operations described hereinare not to be construed as necessarily requiring their performance inthe particular order discussed or illustrated, unless specificallyidentified as an order of performance. It is also to be understood thatadditional or alternative steps may be employed.

When an element or layer is referred to as being “on”, “engaged to”,“connected to” or “coupled to” another element or layer, it may bedirectly on, engaged, connected or coupled to the other element orlayer, or intervening elements or layers may be present. In contrast,when an element is referred to as being “directly on,” “directly engagedto”, “directly connected to” or “directly coupled to” another element orlayer, there may be no intervening elements or layers present. Otherwords used to describe the relationship between elements should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” etc.). As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Although the terms first, second, third, etc. may be used herein todescribe various elements, components, regions, layers and/or sections,these elements, components, regions, layers and/or sections should notbe limited by these terms. These terms may be only used to distinguishone element, component, region, layer or section from another region,layer or section. Terms such as “first,” “second,” and other numericalterms when used herein do not imply a sequence or order unless clearlyindicated by the context. Thus, a first element, component, region,layer or section discussed below could be termed a second element,component, region, layer or section without departing from the teachingsof the example embodiments.

Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”,“lower”, “above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. Spatiallyrelative terms may be intended to encompass different orientations ofthe device in use or operation in addition to the orientation depictedin the figures. For example, if the device in the figures is turnedover, elements described as “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the example term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

Referring to FIG. 1, an electronic device assembly 10, such as acommunication device or a radio assembly includes an interface member12, which is releasably connected to a component 14 such as a cabinet orchassis. Interface member 12 includes an interface mount surface 16which is abutted to and fastenably connected to component 14 and at acabinet mount surface 18 of component 14. At least one and according toseveral embodiments a plurality of fasteners 20 can be used toreleasably connect interface member 12 to component 14. Each of thefasteners 20 can include one or a plurality of fastener seal members 22such an O-rings which seal the fastener 20 within the receiving-apertureof interface member 12 through which fasteners 20 extend to preventliquid entrance through the receiving-aperture.

A front panel surface 24 of electronic device assembly 10 can include afront panel 26, which commonly includes items such as operationalcontrol knobs or buttons and viewing displays, can also be releasablyconnected to interface member 12. In addition, one or more protectivemembers 28, such as molded plastic members, can be attached to the frontpanel 26 to provide a standoff distance from front panel 26 forprotection of the various control features connected thereto. Eachfastener 20 includes a fastener engagement end 30, which is threaded andextends through and beyond a fastener receiving-aperture 31 that extendsentirely through interface member 12.

Interface member 12 can further include a plurality of first connectoror conductor pins 32 extending from interface mount surface 16, whichcan be surrounded by a first seal member 34, such as an O-ring. A sealedpin area 36 is therefore created defining a sealed boundary within firstseal member when interface member 12 is connected to component 14.Conductive/corrosive fluid and/or corrosive environments, which mayenter the space between interface mount surface 16 and cabinet mountsurface 18, is therefore normally isolated from first conductor pins 32by first seal member 34. The fastener seal members 22 of fasteners 20further isolate sealed pin area 36 from conductive/corrosive fluidsand/or corrosive environments present at the front panel surface 24 fromentering sealed pin area 36 via fastener receiving-aperture 31.

A sensor body 38 made predominantly from a non-conductive material, suchas a non-ferrous material (including aluminum or polymeric materials),is fixedly received in component 14 in a sensor receiving cavity 42.Sensor body 38 can be fixed in sensor receiving cavity 42 by a threadedconnection of sensor body 38, a sealing member (not shown in this view)between sensor body 38 and the walls of sensor receiving cavity 42, or asealant such as a sensor body seal 40 positioned about a perimeter ofsensor body 38. Sensor body 38 can optionally include a sensor seal 44,such as an O-ring or gasket material positioned within a cavity ofsensor body 38, which faces and seats against sealed pin area 36 ofinterface member 12 when interface member 12 and component 14 arereleasably connected. Sensor seal 44 can also be used in place of firstseal member 34. A seal engagement member 46, which can be substantiallyflush with cabinet mount surface 18 or extend beyond cabinet mountsurface 18 toward interface mount surface 16, is also provided.

Seal engagement member 46 contacts first seal member 34 when interfacemember 12 is joined to component 14. A sensor element 47, whichaccording to several embodiments is a Hall effect sensor or othernon-direct contact sensor, is accessible via a first body face 48 ofsensor body 38. Sensor element 47 can be inserted into or molded intosensor body 38. Sensor element 47 can also be any of a plurality ofsensor designs that are capable of sensing a magnetic field or material,including a reed sensor, or capacitance sensor. A threaded fastenerengagement aperture 49 extends partially into sensor body 38 from asecond body face 50, which is oppositely oriented with respect to firstbody face 48. Threaded fastener engagement aperture 49 is a blindaperture having no opening through the first body face 48 and,therefore, offers no path for conductive/corrosive fluid and/orcorrosive environments to pass through threaded fastener engagementaperture 49. A plurality of second conductor pins conductively connectwith individual ones of the first conductor pins 32 of interface member12. Each of the second conductor pins is retained in an insert member 52such as a potting material, which can be either individually insertedinto sensor body 38 or poured into sensor body 38.

Referring to FIG. 2 and again to FIG. 1, electronic device assembly 10is shown following connection between interface member 12 and component14 having fastener engagement end 30 of fastener 20 threadably engagedinto threaded fastener engagement aperture 49 of sensor body 38.Insertion of fastener engagement end 30 in a direction “A” pullscomponent 14 towards interface member 12. In the connected conditionshown, sensor seal member 34 abuts against, and, therefore seals againstcabinet mount surface 18 creating sealed pin area 36.

Fastener 20 is a ferrous or magnetic material, or can include an insertof ferrous material. Therefore, when fastener engagement end 30 isreceived in threaded fastener engagement aperture 49, the fastenerengagement end 30 will be sensed by sensor element 47. If fastener 20 isa non-ferrous or non-magnetic material, a magnetic or ferrous materialinsert 53 can be included at fastener engagement end 30 to provide thenecessary proximity indication of fastener engagement end 30. Althoughsensor element 47 is described herein with reference to a Hall effectsensor or a reed sensor, other contactless proximity devices can also beused, such as capacitance sensors, pressure sensors or radio frequencytags positioned at each of sensor body 38 and fastener engagement end30. In each embodiment of the present disclosure, however, sensorelement 47 is intended to provide a “contactless” device defined as apresence indication device where physical contact between fastenerengagement end 30 and sensor element 47 is not required.

Referring to FIG. 3, a first sensing portion 54 is created whenelectronic device assembly 10 is in the assembled condition. A secondsensing portion 55 communicates with the first sensing portion 54.Second sensing portion 55 can include a monitor and control system 56,which can include a plurality of components mounted, for example, on aprinted circuit board or positioned independently of each other. Monitorand control system 56 can include a connector protection portion 57, apin electrical interface 58, and an I/O controller 60. According toseveral embodiments of the present disclosure, connector protectionportion 57 can include a pin monitoring section 62, a connector presencedetection section 64, and a protection decision logic device 66.

Pin monitoring section 62 is connected to the plurality of secondconductor pins, for example, by a conductor device 68 such as a wirebundle or a flex tape. Pin monitoring section 62 is capable ofmonitoring operation in three different modes of operation. In a firstmode, when current flow through the second conductor pins is notanticipated such as during a down-powered state, pin monitoring section62 can be operated in a sleep/sniff mode, wherein pin monitoring system62 periodically awakes from the sleep mode and sniffs or measures for adetectable current flow through the second conductor pins.

According to further embodiments, decision logic device 66 can containinformation concerning a predetermined range of current values (or othermeasured values). In one exemplary operation a normal current value at apower pin included with the second conductor pins is approximately 200milliamps, therefore an exemplary “predetermined range” for this currentcan be 200 milliamps +/−2%. When power is isolated to the secondconductor pins the measured current value should be zero. If aconductive/corrosive fluid and/or corrosive environment has contactedany of the first or second conductor pins 32, 51 and corrosion hasoccurred, a current value measured outside of the predetermined range,for example in a micro-Amp range could be anticipated. When a zerocurrent value is expected, current sensed by pin monitoring section 62measured outside the predetermined range (including the exemplarymicro-Amp current value) will generate a digital first or pin currentOut-Of-Range signal sent to decision logic device 66 indicating acontamination environment may be present.

The “predetermined range” of values as defined herein is based onseveral factors, including 1) whether the sensing portion of the systemmeasures current, voltage, resistance, inductance or other value; 2) adetermination by the system designer of an appropriate normal sensingrange for the sensing portion; and 3) an anticipated measurement thatindicates corrosion has occurred or a corrosive environment has beenencountered by one of more of the conducting pins. For example, thesensing portion can have current or voltage values established as lowend and high end values with all values between the low and high endvalues included. For this example a predetermined range can be 50 to 100milliamps, or 10 to 14 volts. The predetermined range can also be apercentage of an expected current, voltage or other value, for example12 volts DC +/−5%. As a further non-limiting example the predeterminedrange can be a nominal or normal expected value with a plus/minusvariance, such as 10 milliamps +/−1 milliamp. The Out-Of-Range signal istherefore sent when the measured value is outside of the predeterminedrange.

Decision logic device 66 receives the first signal from pin monitoringsection 62 and decision logic device 66 performs the comparison of thecurrent (or other) value received from pin monitoring section 62 to thepredetermined range of current (or other) values to identify if thecurrent (or other) value is of out of the predetermined range of values.Decision logic device 66, upon receipt of the first or Out-Of-Rangesignal can decide that all power to the particular pin or pins should beisolated, or that power to an individual pin should be isolated. In eachof the first and a second operating mode, second sensing portion 56, viaconnector presence detection section 64 produces a second or fastenerpresent signal indicating by a contactless determination the presence offastener 20 which establishes electrical connection of electronic deviceassembly 10.

In the second mode of operation pin monitoring section 62 measurescurrent at one or more of the second conductor pins to determine ifcurrent flow is being degraded from an expected value due tocontamination environment exposure of the pin or pins. During normalpowered operation of the second conductor pins and using the exemplaryexpected current flow of 200 milliamps, if the measured current isdegraded below a pre-determined threshold (for example to 190 milliamps,or a 10% reduction), contamination by a conductive/corrosive fluidand/or corrosive environments and therefore corrosion or exposure to acorrosive environment may be indicated. The second mode of operation canalso be initiated when the pin connection is faulty, for example bybeing incompletely inserted and therefore unable to create an electricalconnection, or providing a power level below the expected power level.

In the second mode of operation, a modified first signal is generated bypin monitoring section 62 and received by both pin electrical interface58 and decision logic device 66, indicating the reduced power level.When either the first or modified first signals of pin monitoringsection 62 is generated during either the first or second modes ofoperation, decision logic device 66 provides a status signal to I/Ocontroller 60 and an enable/disable signal to pin electrical interface58. The first and second modes of operation both require that sensorelement 47 indicate presence of fastener engagement end 30 by the secondsignal transferred between sensor 47 and connector presence detectionsection 64 via a conductor 72. Conductor 72 can be, for example, a wirebundle or a flex tape. A non-ferrous body wall 70 defining a portion ofsensor body 38 is maintained between fastener engagement end 30 and anyportion of sensor element 47 to ensure that the contactless condition iscreated for sensor body 38. Non-ferrous body wall 70 precludesconductive/corrosive fluid passage through fastener engagement aperture49.

A third mode of operation is provided when interface member 12 is notconnected to component 14 such as when fastener engagement end 30 is notsensed by sensor element 47. In the third mode of operation pinmonitoring section 62 will be periodically queried and an anticipatedzero current flow is expected through any of the second conductor pins.The rate of query (time interval between sleep cycles to test query) canbe, for example, every 10-15 seconds during the third mode because noelectrical connections are made and therefore no current flow isexpected, and the opportunity for contamination by conductive/corrosivefluids and/or corrosive environments is reduced (the equipment issubstantially “off-line”). Again, a measured current (for example in thepredetermined micro-Amp range) at any of the second conductor pins mayindicate contamination and subsequent corrosion at the conductor.

The signals sent by pin monitoring section 62 to pin electricalinterface 58 are communicated via a signal interface path 74, and thesignals forwarded from pin electrical interface 58 to I/O controller 60are communicated via a signal interface path 76. Decision logic device66 can forward signals to pin electrical interface 58 via anenable/disable interface path 78. Pin electrical interface 58 canfunction as a conversion device to convert the signals of a pinmonitoring section 62 or decision logic device 66 microprocessor to adifferent format, for example, a format required for a signaling devicesuch as RS-232 format or in USB format. This permits interface betweenconnector protection portion 57 and I/O controller 60 to additionalequipment (not shown).

In each of the first and second operating modes, fastener engagement end30 is sensed by sensor element 47 and pin monitoring section 62 operatesby sensing/measuring a current flow at one or more of the secondconductor pins. According to further embodiments, sensor element 47 canalso produce a signal when a predetermined voltage potential is measuredat specific ones of second conductor pins.

Decision logic device 66 can forward a status signal via a status signalinterface path 80 to I/O controller 60 and can receive a signal from I/Ocontroller 60, for example, as a test command via a test request signalinterface path 82. One function of decision logic device 66, whenreceiving a signal from pin monitoring section 62, is to identify whenan out-of-range or predetermined threshold current value exists at anyof the second conductor pins, which may be indicative of the presence ofa conductive/corrosive fluid and/or corrosive environments or corrosiondamage therefrom. The status signal sent by decision logic device 66 inthis condition, via status signal interface path to I/O controller 60,provides input for I/O controller 60 which can, for example, signal asecondary device (not shown) to provide audible or visual indication ofa contamination possibility.

As previously noted, decision logic device 66, during the sleep/sniffoperating mode, can be periodically awakened by I/O controller 60 by atest signal via test request signal interface path 82. Decision logicdevice 66 then queries one or more of the second conductor pins via pinmonitoring section 62. Decision logic device 66 receives the signalsfrom pin monitoring section 62 and can collectively down power theelectronic device assembly 10 or down power individual ones of thesecond conductor pins. During the first and second modes of operation,the rate of query (time interval between sleep cycles to test query) isshorter than during the third mode of operation, for example once persecond, because early indication of powered operation is desired when aconnection is initially made to second conductor pins or current beginsto flow through any of second conductor pins.

A monitoring system 84 is created by the combination of electronicdevice assembly 10 and monitoring and control system 56. Monitoringsystem 84 provides the benefit of a contactless sensor, such as a Halleffect sensor in the position of sensor element 47. Monitoring system 84provides the capability of detecting when contamination by aconductive/corrosive fluid and/or corrosive environments may beoccurring and provides the capability to down power portions or all ofthe system, thereby protecting the integrity of the electricalcomponents therein. Monitoring system 84 provides the capability of afully automatic monitoring system and does not require manual interfaceupon detection of a conductive/corrosive fluid and/or corrosiveenvironments or degraded current flow.

Any pin of second conductor pins having a voltage potential or currentflow between itself and one or more of the other conductive pins or whenfurther connected to a device (not shown) is monitored for current flowand/or signal integrity. If the measured current is outside of theexpected or predetermined current range then the pin or pins sourcingthis current can be electrically disconnected by decision logic device66. In addition, if a pin is found to be sourcing current but the signalintegrity cannot be established, then unintended current paths areassumed to be present which could compromise the electronic deviceassembly 10. In this situation monitoring system 84 will remove powerfrom the pin(s) in which current flow is detected.

Pin monitoring section 62 can include devices for current and/or voltagemeasurement, such as op-amplifiers, comparators, or high impedencecurrent amplifiers which are connected across the resistive element(conductor pin) producing a gain. Windowing can be performed on theoutput to identify if the measured amperage or voltage is outside of apredetermined threshold.

Connector presence detection section 64 can, in a first condition,provide a fastener present or fastener absent indication from sensorelement 47. A fastener present indication results from proximity offastener engagement end 30 of fastener 20 to sensor element 47. Thefastener 20 is present for the first and second operating modes and isabsent for the third operating mode. Connector presence detectionsection 64 can, in a second condition, indicate by a strong signalstrength a fully seated condition of fastener 20, and by a weaker signalstrength a non-fully seated condition of fastener 20. Remedial actioncan be taken upon indication of the weaker signal strength to re-torquefastener 20.

Decision logic device 66 is a logic device such as a programmablemicro-controller or a state machine. Profiles of each individual secondconductor pin 51 are stored in decision logic device 66, so that apredetermined current or voltage at each of the pins during the variousoperating modes is saved, and can be used as a baseline against which iscompared the measured current or voltage determined by pin monitoringsection 62.

Pin electrical interface 58 (PHY) can be enabled or disabled by signalsfrom decision logic device 66. Pin electrical interface 58 will bedisabled for example when the current or voltage at any one of thesecond conductor pins is outside of the threshold values stored indecision logic device 66 to protect pin electrical interface 58. I/Ocontroller 60 is a high level device that can communicate with outsidedevices (not shown), can over-ride decision logic device 66 when sendinga test request for data from one or more pins, and can communicate thesystem status to the outside device(s).

Monitoring system 84 can be used to monitor systems having conductorpins exposed to conductive fluids such as seawater, chemicals, and/or tocorrosive environments such as salt spray, fog and the like, hereincollectively referred to as conductive/corrosive fluids. Conductor pinsexposed to conductive/corrosive fluids can suffer electrical contactdegradation by electrolysis including galvanic corrosion betweenterminals, contacts, connecting pins and the like that are energized orconnected to a current source (actively signaling).

Monitoring system 84 employs a periodic sampling approach to reapplypower to individual ones of second conductor pins in the electronicdevice assembly 10 to detect if the situation which could compromiseelectronic device assembly 10 is resolved or if correct connector matinghas occurred. Monitoring system 84 can therefore provide power to one ormore of the pins for brief intervals when in a down-powered state. Sincethese periods are minimized and brief, the risk of connector damage isreduced or eliminated. Monitoring system 84 provides an additionalbenefit of conserving system power by eliminating unintended currentpaths. According to several embodiments a contactless approach is usedto detect a mated connector pairing using a Hall effect or similarmagnetic detection sensor with a sensor-detectable mounting screw (e.g.,fastener engagement end 30 of fastener 20). The contactless sensorsystem is used to isolate the sensor from system fluid to ensure thataddition of the fastener detection sensor does not add furthercontamination paths for conductive/corrosive fluid to enter the system.Alternative contactless methods can also be used in place of the Halleffect sensor as sensor element 47, including but not limited toinductive loops, optical sensors, pressure sensors, and/or radiofrequency (RF) signaling or RF tags.

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the invention. Individual elements or features ofa particular embodiment are generally not limited to that particularembodiment, but, where applicable, are interchangeable and can be usedin a selected embodiment, even if not specifically shown or described.The same may also be varied in many ways. Such variations are not to beregarded as a departure from the invention, and all such modificationsare intended to be included within the scope of the invention.

What is claimed is:
 1. A monitoring system for conductor pins exposed toconductive/corrosive fluids, comprising: a first sensing portion havinga pin monitoring section to measure a pin current flow of at least oneconductor pin, compare the pin current flow to a predetermined range ofvalues, and produce a first signal indicative of the pin current flow;and a second sensing portion configured to produce a second signalindicative by a contactless determination the presence of a fastenerproviding physical connection between an interface member and acomponent having the at least one conductor pin positioned therein; anda decision logic device to receive the first and second signals andisolating electrical power to the at least one conductor pin when thefirst signal indicates the pin current flow of at least one conductorpin is outside of the predetermined range of values.
 2. The monitoringsystem of claim 1, further including a sensor body created of anon-ferrous material connected to the component, the sensor bodyincluding a first insert member having the at least one conductor pinextending therefrom.
 3. The monitoring system of claim 2, wherein thesensor body further includes a second insert member defining acontactless sensor to sense proximal presence of the fastener.
 4. Themonitoring system of claim 3, wherein the sensor body further includes ablind fastener engagement aperture created in the sensor body proximalto the second insert member and spaced from the sensor by a body wall ofthe non-ferrous material, the fastener extending from the interfacemember and received in the engagement aperture.
 5. The monitoring systemof claim 3, wherein the contactless sensor comprises one of a Halleffect sensor, a reed sensor, an optical sensor, a pressure sensor, or aradio frequency tag.
 6. The monitoring system of claim 2, wherein theinterface member includes a seal member engaged by a seal engagementmember of the sensor body when the seal member contacts the component.7. The monitoring system of claim 1, wherein the at least one conductorpin comprises a first plurality of conductor pins, and wherein theinterface member includes a second plurality of conductor pins,individual ones of the second plurality of conductor pins connected toindividual ones of the first plurality of conductor pins when thefastener releasably couples the interface member to the component.
 8. Anelectronic device assembly, comprising a chassis having a cavity; aconnector subassembly disposed in the cavity and includes: a firstconnector having a plurality of conductor pins extending therefrom; apin monitor section operable to measure current flow through at leastone of the plurality of conductor pins and produce a first signalindicative of the current flow; a contactless sensor operable to detectpresence of a fastener and produce a second signal indicative ofpresence of the fastener, wherein the fastener releasably connects asecond connector to the first connector; and a controller configured toreceive the first signal and the second signal and operable to comparethe current flow to a threshold, wherein value for the threshold dependson value of the second signal.
 9. The electronic device assembly ofclaim 8 wherein the connector subassembly is comprised of a non-ferrousmaterial.
 10. The electronic device assembly of claim 8 wherein theconnector subassembly includes a blind fastener engagement aperturecreated therein proximal to the contactless sensor and spaced from thecontactless sensor by a body wall of the non-ferrous material, such thatthe fastener is received in the engagement aperture.
 11. The electronicdevice assembly of claim 8 wherein the contactless sensor includes oneof a Hall effect sensor, a reed sensor, an optical sensor, or a pressuresensor.
 12. The electronic device assembly of claim 8 further comprisesa second connector having a plurality of conductor pins electricallycoupled to the plurality of conductor pins of the first connector whenthe fastener couples the second connector to the first connector. 13.The electronic device assembly of claim 8 wherein the controllercompares the current flow to a threshold having a first value when afastener is present and compares the current flow to a threshold havinga second value when the fastener is absent.
 14. The electronic deviceassembly of claim 13 wherein the controller determines whether currentflow is expected through the plurality of conductor pins based on anoperating state of the electronic device and compares the current flowto a threshold having the first value when current flow is expected andcompares the current flow to a threshold having a second value when afastener is present but current flow is not expected.
 15. An electronicdevice assembly, comprising a first connector having a first pluralityof conductor pins extending therefrom; a chassis having a cavity; aconnector subassembly disposed in the cavity and includes: a secondconnector having a second plurality of conductor pins and adapted toreleasably couple to the first connector, such that the first pluralityof conductor pins are electrically coupled to the second plurality ofconductor pins; a pin monitor section operable to measure current flowthrough at least one of the second plurality of conductor pins andproduce a first signal indicative of the current flow; a sensorconfigured to detect presence of a fastener in a contactless manner andproduce a second signal indicative of presence of the fastener, whereinthe fastener releasably connects the second connector to the firstconnector; and a controller configured to receive the first signal andthe second signal and operable to compare the current flow to athreshold, wherein the threshold having a first value when a fastener ispresent and a second value when the fastener is absent.
 16. Theelectronic device assembly of claim 15 wherein the connector subassemblyis comprised of a non-ferrous material.
 17. The electronic deviceassembly of claim 15 wherein the connector subassembly includes a blindfastener engagement aperture created therein proximal to the contactlesssensor and spaced from the contactless sensor by a body wall of thenon-ferrous material, such that the fastener is received in theengagement aperture.
 18. The electronic device assembly of claim 15wherein the contactless sensor includes one of a Hall effect sensor, areed sensor, an optical sensor, or a pressure sensor.
 19. The electronicdevice assembly of claim 18 wherein the controller determines whethercurrent flow is expected through the plurality of conductor pins basedon an operating state of the electronic device and compares the currentflow to a threshold having the first value when current flow is expectedand compares the current flow to a threshold having a second value whena fastener is present but current flow is not expected.